Highly Accelerated Stress Test (HAST) For Low-cost Flip Chip on Board Technology

Flip chip on board (FCOB) technology has been in widespread application. The reliability testing of solder-joints and the delamination between underfill and chip or substrate is still a critical issue for FCOB technology. In this paper, an accelerated environmental testing HAST-was used to rapidly evaluate the reliability of area array solder bumped packages on FR-4 PCBs. The test results intend to identify the effective reliability test criteria for low-cost FCOB technology.

This paper appears in: Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on vol., no., pp. 386-388, 28-30 Oct. 2003