This technical study examines ultrasonic bonding HAST testing as a method for evaluating the long-term reliability of wire bonds and die-attach interfaces under accelerated moisture stress. Both HAST and THB methods are applied to ultrasonic bond specimens to identify failure modes at the package and board interconnect level.

Ultrasonic Bonding HAST Testing: Test Methodology and Findings

HAST (Highly Accelerated Stress Test) Articles:

Reliability Tests of Ultrasonic Bonding Methods Using HAST and THB

Reliability is one of the most important questions in any application, on both the package (component) and the board (system) levels. The paper describes some life time test methods, equipment and processes for evaluating the most important reliability parameters. It gives a detailed description of the most effective and economical HAST (highly accelerated stress test) and THB (temperature humidity and bias) methods.

The paper presents some new results of using HAST and THB technology for the following fields of reliability and life time tests: reliability analysis of assembled SMD passive components; water addition speed tests. Finally, the paper particularly deals with ultrasonic bonding technology, the bonding and testing machines. It introduces some measurement test results on the bonding force before and after a HAST and THB test.

This paper appears in: Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. 27th International Spring Seminar

For more information, see our guide on HAST testing fundamentals and JEDEC standards.